Shenzhen Huazhisheng New Material Technology Co., Ltd.
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Dowsil 744 Circuit Board Component Bonding RTV Adhesive Sealant
Basic Properties
Dowsil™ 744 is a one-part, white, non-flowing RTV adhesive sealant designed for general-purpose bonding. With high elongation (590%) for stress relief, it cures at room temperature without mixing or ovens, and supports heat acceleration for faster production.
Product Description
Curing via ambient moisture (30–80% RH), it achieves >90% physical properties in 24–72 hours. With a 10-minute skin-over time (25°C/50% RH) and workable time of 10–120 minutes, it cures inward at 0.25 inch/7 days. Silicone chemistry ensures stability across -45°C to 200°C with dielectric strength (15 kV/mm), ideal for electronics requiring long-term reliability.
Characteristics
Beyond elongation, its tensile strength (2.7 MPa), tear resistance (20 N/cm), and low modulus (0.5 MPa) enable flexible bonding with minimal substrate stress. Shore A hardness 37 balances flexibility/support, while volume resistivity (5×10¹³ Ω·cm) ensures insulation. Adhesion to aluminum reaches 430 psi (substrate testing required), with 12-month shelf life (25°C).
| Property | Unit | Result |
|---|---|---|
| Physical Properties | ||
| Extrusion Rate | g/min | 184 |
| Viscosity (1/s) | Pa·s | 753 |
| Viscosity (10/s) | Pa·s | 135 |
| Slump | cm | 0.6 |
| Tensile Strength | MPa | 2.7 |
| Elongation | % | 590 |
| Tensile Modulus | MPa | 0.5 |
| Tear Strength (Die B) | N/cm | 20 |
| Adhesion | ||
| Lap Shear to Aluminum | MPa | 3 |
| Electrical | ||
| Dielectric Strength | kV/mm | 15 |
| Volume Resistivity | Ω·cm | 5E+13 |
| Curing | ||
| Skin-Over Time (25°C/50% RH) | minutes | 10 |
| Tack-Free Time (25°C) | minutes | 55 |
| Others | ||
| Specific Gravity (Cured) | - | 1.42 |
| Shore A Hardness | - | 37 |
| Shelf Life (25°C) | months | 12 |
| UL Flammability | - | 94-HB |
Scenario application
Designed for automated/manual dispensing, it bonds large components (e.g., batteries, capacitors) to PCBs. Industry cases include capacitor fixation in EV battery modules, heatsink bonding in industrial power supplies, and shock-resistant encapsulation of HV capacitors in telecom equipment.