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Shin-Etsu X-23-7783D High-Performance Thermal Grease - Advanced TIM for Microprocessor Cooling

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Province/State:guangdong
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Contact Person:Mrouyang
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Shin-Etsu X-23-7783D High-Performance Thermal Grease - Advanced TIM for Microprocessor Cooling

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Place of Origin :JAPAN
Brand Name :ShinEtsu
Model Number :ShinEtsu X-23-7783
Price :CN¥3,626.26/kilograms 1-49 kilograms
Certification :TDS,SDS,Rohs
CAS No. :ShinEtsu
Other Names :ShinEtsu X-23-7783
Main Raw Material :Silicone
Usage :Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
Type :Thermal interface material
product name :ShinEtsu X-23-7783
Package :1kg/Piece
Temperature Resistance :High
Adhesion :Strong
Non-Toxic :Yes
Chemical Resistance :Excellent
Product Type :Silicone
Water Resistance :Excellent
Flexibility :High
Odorless :Yes
Heat Resistance :High
Viscosity :High
Uv Resistance :High
Durability :Long-lasting
MOQ :1
Packaging Details :1 piece
Delivery Time :5-8days
Payment Terms :T/T,L/C,D/A,D/P,Western Union,MoneyGram
Supply Ability :1000Piece
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Shin-Etsu X-23-7783D High-Performance Thermal Grease - Advanced TIM for Microprocessor Cooling

Basic Product Attributes​

Shin-Etsu X-23-7783D is a gray, high-viscosity thermal grease designed for cooling high-performance microprocessors, with thermal conductivity up to 6 W/mK (solvent-free) and 2% solvent content for screen-printing compatibility.


Product Description​

Developed by Shin-Etsu Chemical, X-23-7783D thermal grease enhances heat dissipation by eliminating air gaps (air conductivity: 0.027 W/mK) between processors and heat sinks. It is applied to the processor top, pressed evenly, and excess can be wiped with a soft cloth.


Key Features​

  1. Solvent-based: Contains 2wt% solvent for screen-printing; requires stirring and 60°C/30min curing.
  2. High stability: Store below 10°C; use promptly after opening.
  3. Dual conductivity: 4 W/mK (with solvent), 6 W/mK (solvent-free as X-23-7783).

Applications

X-23-7783D is widely used in server CPUs, GPUs, and high-power LED cooling, particularly in automated screen-printing processes. Recommended by Intel/AMD for processors with TDP >100W


Technical Specifications

Property Value
​Appearance​ Gray
​Viscosity (25°C)​ 1500 Poise
​Thermal Conductivity​ >4 W/mK (with solvent)

>6 W/mK (w/o solvent, as X-23-7783)
​Volatile Content​ 2.5% (150°C×24hrs)


1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination


Shin-Etsu X-23-7783D High-Performance Thermal Grease - Advanced TIM for Microprocessor Cooling

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