Electrolube HTCX Non-Silicone Thermal Paste for Efficient Electronic Heat Dissipation
Product Properties
Property | Value |
Colour | White |
Base | Blend of synthetic fluids |
Thermo-conductive Component | Powdered metal oxides |
Density @ 20°C (g/ml) | 2.61 |
Cone Penetration @ 20°C | 300 |
Viscosity at 1rpm (Pa s) | 127-141 |
Thermal Conductivity (Guarded Hot Plate) | 1.35 W/m·K (calculated) |
Thermal Conductivity (Heat Flow) | 0.90 W/m·K |
Temperature Range | -50°C to +180°C* |
Weight Loss after 96 hours @ 100°C | <0.40% |
Permittivity @ 1 GHz | 4.2 |
Volume Resistivity | 1 × 1014 Ohms-cm |
Dielectric Strength | 42 kV/mm |
Product Introduction
Electrolube HTCX is a high-performance, non-silicone heat transfer compound designed as an enhanced version of HTC, featuring improved thermal conductivity, lower oil bleed, and reduced evaporation weight loss. It serves as a reliable thermal interface material for efficient heat dissipation between surfaces, ideal for applications where silicones are prohibited to avoid issues with silicone migration. The paste is non-curing, enabling easy rework of components, and is approved for RoHS compliance (2015/863/EU).
Enhanced Properties
The thermal conductivity values vary based on measurement methods: the guarded hot plate method yields a calculated 1.35 W/m·K, while the heat flow method provides a more accurate 0.90 W/m·K due to accounting for surface resistance. Key attributes include excellent stability under varying temperature and humidity, low weight loss (<0.40% after 96 hours at 100°C) indicating minimal degradation, and high electrical insulation properties (volume resistivity of 1 × 1014 Ohms-cm and dielectric strength of 42 kV/mm). The density of 2.61 g/ml and viscosity range of 127-141 Pa·s ensure easy application, but performance depends on achieving a thin, uniform film to maximize heat flow efficiency.
Application Scenarios
Electrolube HTCX is specifically used for thermal management in electronic components such as diodes, transistors, thyristors, heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors, and radiators, as detailed in the TDS "Directions for Use" section. Online sources (e.g., Electrolube official website and distributor datasheets) confirm its application in CPU/GPU cooling, power electronics, automotive sensors, and industrial equipment where non-silicone thermal paste is required to prevent contamination and ensure efficient heat dissipation under harsh conditions.
FAQ
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination
